Dear Workshop Attendees:

Thank you for participating in the upcoming NSF/DOE/APC Future of Modeling in Composites Molding Processes workshop to be held June 9-10, 2004 at the NSF Office Building in Arlington, VA. We look forward to meeting you there.

As participants in this workshop, each of you are being asked to give a brief presentation related to the role of modeling in composites molding processes. Each of your presentations will be limited to 15 minutes and should address the following items for the group (e.g., materials and measurements, processing and manufacturing, etc..) where you have been assigned:

1. Describe your research related to the workshop topic and group
2. Describe the current state of the art in this area
3. Provide a vision on where this area needs to be in the future
4. Described perceived gaps between where we are now, and where we should be
5. Provide specific research thrusts that are required to fill these gaps

We suggest you limit the number of slides to 1 or 2 in each of these items. We will collect these presentations in preparation for the workshop meeting so that group leaders can use this information to generate a summary for the workshop. Please submit your presentation (preferably as a Power Point file) by May 27 to SmithDoug@Missouri.edu.

In addition, many of you will have your travel expenses covered by NSF which will be covering reasonable expenses related to your attending this workshop including airfare, hotel, and meals. Note that some of the meals are being provided as part of the workshop by APC. You are responsible for making all of your own travel arrangements and the costs will be reimbursed to you following the workshop. You will receive more details on the reimbursement process at the meeting, but keep in mind you will need receipts for any expenses you wish to have covered.

Please contact us with any questions.

Thanks,
Suresh and Doug